A diverse, talent-supporting company, recognized as a leader in inspection and metrology, empowering our customers for higher yields and faster time-to-market.

Grenoble, France
Joined December 2016
We are proud to announce our collaboration with @UnitySemi - for further development to fuel #Industry 4.0 with smarter tools leti-cea.com/cea-tech/leti/e…
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We'll be in good company this week at the #MEPTEC event @SEMIexpos HQ with @asegroup_global @AmkorTechnology @STATSChipPACLtd @XilinxInc @intel @Microsoft - meptec.org/2017Q4/
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Great discussions on future packaging trends at IMAPS including FO-WLPs, Intel's new LGA (long live LGA), and Xilinx HBM + FPGA!
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Today, MEMS&Sensors Summit @MEMSGroup, Volker Herbig talks about: From sampling to ramping: the long way towards high volume MEMS production
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UnitySC retweeted
An inspired SEMI #CEO and inspiring SEMI #Europe President set the stage for an exciting #MEMS Summit ahead. ASE thrilled to partner. #SiP – at Grenoble, France
TechSearch International celebrates our 30th Anniversary! So many changes in our industry in the last 30 years!!!
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Read the latest EE Web Exclusive! Overcoming thin-wafer inspection challenges for high-volume manufacturing evaluationengineering.com/ov…
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Dr. SW Yoon will be presenting “eWLB FOWLP: Good to Great” at the iNEMI Q3 Webinar on Aug 28 & 29. bit.ly/2ivkfbc
See you and the crew at Semicon West!! lnkd.in/gvTzrZm
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Packaging for #autonomous vehicle electronics? Join us today for an engaging plenary session at #ECTC2017 ow.ly/6yhm30bgZNi
UnitySC retweeted
Semiconductor Engineering@SemiEngineering11 May 2017
2.5D, Fan-Out Inspection Issues Grow semiengineering.com/2-5d-fan… … #fanout #3DIC #metrology #Inspection #TSVs
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UnitySC retweeted
ASE's Ou Li comments on the increasingly stringent world of device #inspection and describes what ASE is doing #SiP bit.ly/2r2xoZz – at Sunnyvale, CA
UnitySC retweeted
Heterogeneous Integration big topic at Build China's IC Ecosystem Forum #semiconchina #semiconductor
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UnitySC retweeted
#Fanout is trending big time at @IMAPSOfficial conference #DPC2017 @Intel @Infineon @STATSChipPACLtd @Yole_Dev. Well done to @Yole_JAZ
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Join us at @IMAPSOfficial Device Packaging Conf for #fanoutwlp #eWLB #SiP #automotive info at booth 55 bit.ly/2mtUadZ
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Join us at @IMAPSOfficial Device Packaging Conf for #fanoutwlp #eWLB #SiP #flipchip #automotive info at booth 55 bit.ly/2mtUadZ
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UnitySC retweeted
Very nice #3DSummit conference summary & wrap by Francoise @3DInCites @SEMIEurope #Queenof3D #3DIC #SiP – at Grenoble, France